NEWS
Semiconductor Packaging Substrate Repair Technology

Semiconductor Packaging Substrate Repair Technology
Building on decades of expertise in equipment design and system integration, A-TECH has developed a high-precision laser repair process capable of micron-level restoration for fine circuit lines. Our advanced repair equipment is specifically designed for high-end substrate manufacturing and is applicable to circuit boards and IC substrates used in AI, 5G communications, smart automotive systems, and consumer electronics. This technology significantly improves production yield and reduces material waste—supporting both next-generation AI applications and environmental sustainability.
A-TECH’s PCB Laser Repair System supports advanced defect restoration for IC substrates, with minimum line/space (L/S) resolution down to 2μm and substrate damage controlled below 3μm. In addition to standard configurations, we offer customizable upgrade options to meet diverse production needs, delivering equipment solutions that combine flexibility, high yield, and exceptional stability.
Semiconductor, Printed Circuit Board, ABF Substrate, HDI, HLC