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PRODUCT
Diamond Wire Saw Cutting Service
Diamond Wire Saw
Cutting Service
A-Tech System provides a complete service to support your material project from Multi-Wire Saw machine to material cutting service.
Our ASE diamond wire saw cutting series deliver efficiency and stability to maximize cutting quality. We also fulfill customized size cutting requirements for dies, round or ring shape by precision laser cutting service.
Materials Sliced:
Our ASE diamond wire saw cutting series deliver efficiency and stability to maximize cutting quality. We also fulfill customized size cutting requirements for dies, round or ring shape by precision laser cutting service.
Materials Sliced:
- Ceramic
- Silicon
- Sapphire
- Quartz
- Crystal
- Silicon Carbide
- Glass
- Other fragile and hard materials
Sapphire Wafer Applications:
- Microelectronic Industry (such as: High Tc superconductor and microwave IC application)
- Optoelectronics Industry (Ex.: Blue LED)
- Laser diodes
- Diameter: Max 6 inches
- Flip Chip package applications (Ex.: Automotive headlights, Household lighting)
- Laser excitation
- COB package applications